Effects of Cu incorporation as an acceptor on the thermoelectric transport properties of Cu^sub x^Bi^sub 2^Te^sub 2.7^Se^sub 0.3^ compounds

We report the effects of Cu incorporation on the thermoelectric transport properties in n-type CuxBi2Te2.7Se0.3 (0 ≤ x ≤ 0.08) compounds. The acceptor roles of Cu in the compounds were elucidated by the charge and thermal transport properties. Considerable change in the density of state (DOS) effect...

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Bibliographic Details
Published inJournal of alloys and compounds Vol. 696; p. 213
Main Authors Jeong, Mahn, Tak, Jang-yeul, Lee, Soonil, Seo, Won-Seon, Cho, Hyung Koun, Lim, Young Soo
Format Journal Article
LanguageEnglish
Published Lausanne Elsevier BV 05.03.2017
Subjects
Charge transport
Copper
Density of states
Figure of merit
Generators
Operating temperature
Plasma sintering
Thermal energy
Thermoelectricity
Transport properties
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Summary:We report the effects of Cu incorporation on the thermoelectric transport properties in n-type CuxBi2Te2.7Se0.3 (0 ≤ x ≤ 0.08) compounds. The acceptor roles of Cu in the compounds were elucidated by the charge and thermal transport properties. Considerable change in the density of state (DOS) effective mass depending on the Cu content was evidenced by the cross-over of Seebeck coefficients, and the effects of the DOS effective mass on the thermoelectric transport properties were interpreted by temperature-normalized Pisarenko plot. Significant enhancement of thermoelectric figure of merit and the control of optimum operating temperature could be achieved by the Cu incorporation, and their origins were discussed.
ISSN:0925-8388
1873-4669