Emerging multigigahertz digital and mixed-signal integrated circuits targeted for military applications : Dependence on advanced electronic packaging to achieve full performance Interconnections-Addressing the Next Challenge of IC Technology. Part I: Integration and Packaging Trends
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Published in | Proceedings of the IEEE Vol. 89; no. 4; pp. 426 - 443 |
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Main Authors | , , , , , , , , |
Format | Journal Article |
Language | English |
Published |
New York, NY
Institute of Electrical and Electronics Engineers
2001
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Subjects | |
Online Access | Get full text |
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ISSN: | 0018-9219 1558-2256 |
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