C-4/CNGA comparison with other MLC single chip package alternatives
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Published in | IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging Vol. 18; no. 2; pp. 250 - 256 |
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Main Authors | , |
Format | Conference Proceeding |
Language | English |
Published |
New York, NY
Institute of Electrical and Electronics Engineers
1995
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Subjects | |
Online Access | Get full text |
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ISSN: | 1070-9894 1558-3686 |
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