Industry Compatible Embossing Process for the Fabrication of Waveguide-Embedded Optical Printed Circuit Boards : OPTICAL INTERCONNECTS

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Bibliographic Details
Published inJournal of lightwave technology Vol. 31; no. 21-24; pp. 4045 - 4050
Main Authors WEI JIN, KIN SENG CHIANG, KAR PONG LOR, HAU PING CHAN, TO, Jack T. L, LEUNG, Raymond H. M
Format Journal Article
LanguageEnglish
Published New York, NY Institute of Electrical and Electronics Engineers 2013
Subjects
Applied sciences
Circuit properties
Electric, optical and optoelectronic circuits
Electronics
Exact sciences and technology
Integrated optics. Optical fibers and wave guides
Microelectronic fabrication (materials and surfaces technology)
Miscellaneous
Optical and optoelectronic circuits
Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices
Mass production
polymer waveguide
High temperature
optical printed circuit board (OPCB)
Optical circuit
Optical polymers
Optical losses
Integrated circuit bonding
Long channel
Microelectronic fabrication
Channel waveguide
waveguide fabrication
optical polymer
Stratification
Optical interconnection
Embossing
Acoustic signal
Printed circuit board
Waveguide
Repeatability
Manufacturing process
Optical interconnect
Embedded transducer
Printed circuit
Pitch(acoustics)
Reflow soldering
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ISSN:0733-8724
1558-2213