Deep reactive ion etching of sub-micrometer trenches with ultra high aspect ratio
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Published in | Microelectronic engineering Vol. 113; pp. 35 - 39 |
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Main Authors | , , , , , |
Format | Journal Article |
Language | English |
Published |
Amsterdam
Elsevier
2013
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Subjects | |
Online Access | Get full text |
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ISSN: | 0167-9317 1873-5568 |
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