Early experience with in situ chip-to-chip alignment characterization of Proximity Communication flip-chip package : Advances in wafer level packaging
Saved in:
Published in | Microelectronics and reliability Vol. 50; no. 4; pp. 498 - 506 |
---|---|
Main Authors | , , , , , , , , |
Format | Journal Article |
Language | English |
Published |
Kidlington
Elsevier
2010
|
Subjects | |
Online Access | Get full text |
Cover
Loading…
ISSN: | 0026-2714 1872-941X |
---|