An approach of numerical multi-objective optimization in stacked packaging : Thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systems (EuroSimE 2007)

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Bibliographic Details
Published inMicroelectronics and reliability Vol. 48; no. 6; pp. 851 - 857
Main Authors DOWHAN, Lukasz, WYMYSLOWSKI, Artur, DUDEK, Rainer
Format Journal Article
LanguageEnglish
Published Oxford Elsevier 2008
Subjects
Applied sciences
Design. Technologies. Operation analysis. Testing
Electronics
Exact sciences and technology
Integrated circuits
Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices
Performance evaluation
Die
Multichip module
Electronic packaging
Portable equipment
Reliability
Optimization
Wafer
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ISSN:0026-2714
1872-941X