Comparison of Fluid Flow and Thermal Characteristics of Plate-Fin and Pin-Fin Heat Sinks Subject to a Parallel Flow Recent topics in electronics cooling-From transistors to systems

Saved in:
Bibliographic Details
Published inHeat transfer engineering Vol. 29; no. 2; pp. 169 - 177
Main Authors SUNG JIN KIM, KIM, Dong-Kwon, HWAN HEE OH
Format Journal Article
LanguageEnglish
Published Philadelphia, PA Taylor & Francis 2008
Subjects
Applied sciences
Design. Technologies. Operation analysis. Testing
Electronics
Exact sciences and technology
Integrated circuits
Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices
Electronic equipment
Cooling system
Parallel flow
Heat sink
Comparative study
Finned surface
Heat transfer
Online AccessGet full text
ISSN0145-7632
1521-0537

Cover

More Information
ISSN:0145-7632
1521-0537