Microstructure-based stress modeling of tin whisker growth : Special section on tin whiskers
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Published in | IEEE transactions on electronics packaging manufacturing Vol. 29; no. 4; pp. 265 - 273 |
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Main Authors | , , , , |
Format | Journal Article |
Language | English |
Published |
New York, NY
Institute of Electrical and Electronics Engineers
2006
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Subjects | |
Online Access | Get full text |
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ISSN: | 1521-334X 1558-0822 |
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