Design, analysis, and development of novel three-dimensional stacking WLCSP : Three-dimensional packaging

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Bibliographic Details
Published inIEEE transactions on advanced packaging Vol. 28; no. 3; pp. 387 - 396
Main Authors YUAN, Chang-Ann, CHENG NAN HAN, YEW, Ming-Chih, CHOU, Chan-Yen, CHIANG, Kou-Ning
Format Journal Article
LanguageEnglish
Published Piscataway, NY Institute of Electrical and Electronics Engineers 2005
Subjects
Applied sciences
Design. Technologies. Operation analysis. Testing
Electronics
Exact sciences and technology
Integrated circuits
Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices
Parametric analysis
wafer-level packaging
three- dimensional (3-D) stacking
Numerical method
finite-element method
Chip scale packaging
Finite element method
Integrated circuit bonding
Three dimensional model
Electronic packaging
index Terms-Factorial analysis
Reduced order model
Wafer
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ISSN:1521-3323
1557-9980