Structural, magnetic, and mechanical properties of 5 {mu}m thick SmCo films suitable for use in microelectromechanical systems

5 {mu}m thick SmCo films were deposited onto Si substrates using triode sputtering. A study of the influence of deposition temperature (T{sub dep}{<=}600 deg. C) on the structural, magnetic, and mechanical properties has shown that optimum properties [highest degree of in-plane texture, maximum i...

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Published inJournal of applied physics Vol. 103; no. 4
Main Authors Walther, A., CEA Leti-MINATEC, 17 rue des Martyrs, 38054 Grenoble, Givord, D., Dempsey, N. M., Khlopkov, K., Gutfleisch, O.
Format Journal Article
LanguageEnglish
Published United States 15.02.2008
Subjects
BINARY ALLOY SYSTEMS
COBALT ALLOYS
COERCIVE FORCE
DEPOSITION
MATERIALS SCIENCE
MECHANICAL PROPERTIES
MICROSTRUCTURE
SAMARIUM ALLOYS
SILICON
SPUTTERING
SUBSTRATES
SURFACE AREA
TEMPERATURE DEPENDENCE
TEMPERATURE RANGE 0400-1000 K
TEXTURE
THIN FILMS
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Summary:5 {mu}m thick SmCo films were deposited onto Si substrates using triode sputtering. A study of the influence of deposition temperature (T{sub dep}{<=}600 deg. C) on the structural, magnetic, and mechanical properties has shown that optimum properties [highest degree of in-plane texture, maximum in-plane coercivity and remanence (1.3 and 0.8 T, respectively), and no film peel-off] are achieved for films deposited at the relatively low temperature of 350 deg. C. This temperature is compatible with film integration into microelectromechanical systems. The deposition rate was increased from 3.6 to 18 {mu}m/h by increasing the surface area of the target from 7 to 81 cm{sup 2} while keeping the target potential fixed. Mechanically intact films could be prepared by deposition onto prepatterned films or deposition through a mask.
ISSN:0021-8979
1089-7550
DOI:10.1063/1.2840131