Optimal pressure and temperature for Cu–Cu direct bonding in three-dimensional packaging of stacked integrated circuits

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Bibliographic Details
Published inBiuletyn Uniejowski Vol. 56; no. 3; pp. 180 - 184
Main Authors Seunghyun Yum(염승현), June Won Hyun(현준원)
Format Journal Article
LanguageEnglish
Published 한국표면공학회 2023
Subjects
Cu-to-Cu bonding
C2C
C2W
3D stacking
3D package
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ISSN:1225-8024
2299-8403