OSP화 ENIG 표면처리에 따른 BGA 패키지의 무연솔더 접합부 피로수명

• Published in: 대한금속·재료학회지, 46(2) pp. 80 - 87
• Main Authors: 오철민, 박노창, 홍원식
• Format: Journal Article
• Language: Korean
• Published: 대한금속·재료학회 01.02.2008
• Subjects: 재료공학
• ISSN: 1738-8228; 2288-8241

Many researches related to the reliability of Pb-free solder joints with PCB (printed circuit board) surface finish under thermal or vibration stresses are in progress, because the electronics is operating in hash environment. Therefore, it is necessary to assess Pb-free solder joints life with PCB surface finish under thermal and mechanical stresses. We have investigated 4-points bending fatigue lifetime of Pb-free solder joints with OSP (organic solderability preservative) and ENIG (electroless nickel and immersion gold) surface finish. To predict the bending fatigue life of Sn-3.0Ag-0.5Cu solder joints, we use the test coupons mounted 192 BGA (ball grid array) package to be added the thermal stress by conducting thermal shock test, 500, 1,000, 1,500 and 2,000 cycles, respectively. An 4-point bending test is performed in force controlling mode. It is considered that as a failure when the resistance of daisy-chain circuit of test coupons reaches more than 1,000 Ω. Finally, we obtained the solder joints fatigue life with OSP and ENIG surface finish using by Weibull probability distribution. KCI Citation Count: 10