구리전착층의 물성에 미치는 전해액 조성의 영향

• Published in: 대한금속·재료학회지, 47(11) pp. 740 - 747
• Main Authors: 박은광, 이만형, 우태규, 박일송, 정광희, 설경원
• Format: Journal Article
• Language: Korean
• Published: 대한금속·재료학회 01.11.2009
• Subjects: 재료공학
• ISSN: 1738-8228; 2288-8241

The purpose of this study is to identify the effect of electrolyte compositions on electrodeposited copper foil. First of all, the polyimide substrate was pretreated with plasma. Finally, copper foil was deposited on a Cu/Ni/Polyimide substrate using the electroplating technique. As the quantity of Cu increased, preferred orientations changed into (111). Increasing sulfuric acid, on the other hand, brought down the preferred orientation of (111). The lowest sheet resistance, surface roughness, and fine adhesion were detected when the ratio of Cu2+ and H2SO4 is 50:50(g/l). KCI Citation Count: 3