고온다습처리 조건이 무전해 니켈 도금 박막과 폴리이미드 사이의 계면 접착력에 미치는 영향

• Published in: 대한금속·재료학회지, 47(10) pp. 675 - 680
• Main Authors: 민경진, 정명혁, 이규환, 정용수, 박영배
• Format: Journal Article
• Language: Korean
• Published: 대한금속·재료학회 01.10.2009
• Subjects: 재료공학
• ISSN: 1738-8228; 2288-8241

Effects of 85℃/85% Temperature/Humidity (T/H) treatment conditions on the peel strength of an electroless-plated Ni/polyimide system were investigated from a 180° peel test. Peel strength between electroless-plated Ni and polyimide monotonically decreased from 37.4±5.6 g/mm to 22.0±2.7 g/mm for variation of T/H treatment time from 0 to 1000 hrs. The interfacial bonding mechanism between Ni and polyimide appears to be closely related to Ni-O bonding at the Ni/polyimide interface. The decrease in peel strength due to T/H treatment appears to be related to polyimide degradation due to moisture penetration through the interface and the bulk polyimide itself. KCI Citation Count: 12