전해액 온도에 의한 구리 박막의 표면형상과 물성 변화

• Published in: 대한금속·재료학회지, 47(4) pp. 256 - 260
• Main Authors: 우태규, 이만형, 박은광, 배태성, 이민호, 박일송, 정광희, 설경원
• Format: Journal Article
• Language: Korean
• Published: 대한금속·재료학회 01.05.2009
• Subjects: 재료공학
• ISSN: 1738-8228; 2288-8241

This study examined the effects of plated temperature on the surface morphology and property of an electrodeposited copper foil. The morphology, crystal structure and electric characteristics of the electrodeposited copper foil were examined by scanning electron microscopy, X-ray diffraction, and a four-point probe, respectively. The surface roughness, crystal growth orientation and resistivity could be controlled using various temperature of electrolyte. Large particles were observed on the surface of the copper layer electroplated onto the 30˚C. However, a uniform surface, lower resistivity and high flexibility were obtained when a 50˚C electrolyte was used. KCI Citation Count: 4