Sn-3.5Ag BGA 패키지의 기계적·전기적 특성에 미치는 PCB표면 처리

• Published in: 대한금속·재료학회지, 47(4) pp. 261 - 266
• Main Authors: 성지윤, 표성은, 구자명, 윤정원, 신영의, 정승부
• Format: Journal Article
• Language: Korean
• Published: 대한금속·재료학회 01.05.2009
• Subjects: 재료공학
• ISSN: 1738-8228; 2288-8241

The mechanical and electrical properties of ball grid array (BGA) solder joints were measured, consisting of Sn-3.5Ag, with organic solderability preservative (OSP)-finished Cu pads and Electroless Nickel /Immersion Gold (ENIG) surface finishes. The mechanical properties were measured by die shear test. When ENIG PCB was upper joint and OSP PCB was lower joint, the highest shear force showed at the third reflow. When OSP PCB was upper joint and ENIG PCB was lower joint, the highest shear force showed at the forth reflow. For both joints, after the die shear results reached the highest shear force, shear force decreased as a function of increasing reflow number. Electrical property of the solder joint decreased with the function of increasing reflow number. The scanning electron microscope results show that the IMC thickness at the bonding interface gets thicker while the number of reflow increases. KCI Citation Count: 7