High-Performance Metal-Substrate Power Module for Electrical Applications

This paper demonstrates the performance of a metal-substrate power module with multiple fabricated chips for a high current electrical application, and evaluates the proposed module using a 1.5-kW sinusoidal brushless direct current (BLDC) motor. Specifically, the power module has a hybrid structure...

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Bibliographic Details
Published inETRI journal Vol. 38; no. 4; pp. 645 - 653
Main Authors Kim, Jongdae, Oh, Jimin, Yang, Yilsuk
Format Journal Article
LanguageKorean
Published 2016
Subjects
BLDC Motor
Integrated Multi-chips
Metal-substrate Power Module
High Current Operation
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Summary:This paper demonstrates the performance of a metal-substrate power module with multiple fabricated chips for a high current electrical application, and evaluates the proposed module using a 1.5-kW sinusoidal brushless direct current (BLDC) motor. Specifically, the power module has a hybrid structure employing a single-layer heat-sink extensible metal board (Al board). A fabricated motor driver IC and trench gate DMOSFET (TDMOSFET) are implemented on the Al board, and the proper heat-sink size was designed under the operating conditions. The fabricated motor driver IC mainly operates as a speed controller under various load conditions, and as a multi-phase gate driver using an N-ch silicon MOSFET high-side drive scheme. A fabricated power TDMOSFET is also included in the fabricated power module for three-phase inverter operation. Using this proposed module, a BLDC motor is operated and evaluated under various pulse load tests, and our module is compared with a commercial MOSFET module in terms of the system efficiency and input current.
Bibliography:KISTI1.1003/JNL.JAKO201671261180391
ISSN:1225-6463
2233-7326