반도체 패키징용 기계식 프레스의 최적설계에 관한 연구

• Published in: 한국생산제조시스템학회지 Vol. 22; no. 3; pp. 356 - 363
• Main Authors: 김문기, Kim, Moon-Ki
• Format: Journal Article
• Language: Korean
• Published: 2013
• Subjects: Finite element method; Semiconductor; Mechanical molding press; Optimal design
• ISSN: 2233-6036; 2383-4846

Mechanical molding press which is used for transformation process during semiconductor manufacturing process has structural deformations by pressure. If these deformations have over limit range, life of the press itself can be reduced and it will be exerted on a bad effect for quality of the semiconductor. In this research, the main plates and links of a press are analyzed in relation to the structural deformations caused by pressure excluding thermal deformations. After modifying the modeling, the analysis is performed again to determine optimal design of the press, and this design is introduced to ensure that most of the stresses on the main plates are within safe allowable limits. As a result, an optimal design method for the structure is investigated to produce the desired pressure even when the size of the main structure is minimized.