Rheological Properties of Solder Paste Containing Lead-free Solder Particles Coated with Polymer Wax Particles

Rheological properties of a solder paste containing a lead-free solder powder (Sn-Zn-Bi alloy) uncoated and coated with wax powder (12-hydroxystearic acid) was investigated. Measurement of the rheology of solder pastes with the region of high strain rate within the possible limits was conducted usin...

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Bibliographic Details
Published inGeosystem engineering Vol. 7; no. 3; pp. 63 - 68
Main Authors Kim, Jeong-Hwan, Ahn, Ji-Whan
Format Journal Article
LanguageKorean
Published 2004
Subjects
Rheological property
coating
solder paste
lead-free solder
wax
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Summary:Rheological properties of a solder paste containing a lead-free solder powder (Sn-Zn-Bi alloy) uncoated and coated with wax powder (12-hydroxystearic acid) was investigated. Measurement of the rheology of solder pastes with the region of high strain rate within the possible limits was conducted using a capillary rheometer. During the mechanical dry particle coating process under the appropriate operating conditions, coated particles have been maintained spherical shape. Viscosity of solder paste containing deformed particles became higher than that of a solder paste containing spherical particle before deformation. With 0.33 of strain, the viscosity increases 2 to 3 times higher than that for 0.1. Using the coated particle, the viscosity of solder paste was close to that of solder paste containing original solder particles, when the concentration of the guest particle was about $0.9\;wt.\%$ which is to be considered as optimum concentration of guest particles.
Bibliography:KISTI1.1003/JNL.JAKO200431935942633
ISSN:1226-9328
2166-3394