전해액온도에의한구리박막의표면형상과물성변화

This study examined the effects of plated temperature on the surface morphology and property of an electrodeposited copper foil. The morphology, crystal structure and electric characteristics of the electrodeposited copper foil were examined by scanning electron microscopy, X-ray diffraction, and a...

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Published in대한금속재료학회지 Vol. 47; no. 4; pp. 256 - 260
Main Authors 우태규, Tae Gyu Woo, 이만형, Man Hyung Lee, 박은광, Eun Kwang Park, 배태성, Tea Sung Bae, 이민호, Min Ho Lee, 박일송, Il Song Park, 정광희, Kwang Hee Jung, 설경원, Kyeong Won Seol
Format Journal Article
LanguageKorean
Published 대한금속재료학회 22.04.2009
Subjects
FCCL
flexibility
resistivity
temperature
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Summary:This study examined the effects of plated temperature on the surface morphology and property of an electrodeposited copper foil. The morphology, crystal structure and electric characteristics of the electrodeposited copper foil were examined by scanning electron microscopy, X-ray diffraction, and a four-point probe, respectively. The surface roughness, crystal growth orientation and resistivity could be controlled using various temperature of electrolyte. Large particles were observed on the surface of the copper layer electroplated onto the 30℃. However, a uniform surface, lower resistivity and high flexibility were obtained when a 50℃ electrolyte was used.
Bibliography:The Korean Institute of Metals and Materials
ISSN:1738-8228