Regular Paper : Wafer Burn-in Method of SRAM for Multi Chip Package

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Bibliographic Details
Published inTransactions on electrical and electronic materials Vol. 5; no. 4; pp. 138 - 142
Main Authors Hoo Sung Kim, Je Yoon Kim, Man Young Sung
Format Journal Article
LanguageKorean
Published 한국전기전자재료학회 30.08.2004
Subjects
Burn-in
Multi Chip
Reliability
Stress
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Bibliography:The Korean Institute of Electrical and Electronic Material Engineers
ISSN:1229-7607