A thirdgeneration circuit printing process

This paper concerns a novel process for forming additive copper interconnect on flexible substrates via printing and plating processes. Building on the established conductive lithographic film and CLF plating seeding technologies, the described process enables lowcost substitutes for existing flexib...

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Bibliographic Details
Published inCircuit world Vol. 28; no. 2; pp. 9 - 10
Main Authors Evans, P.S.A., Harrey, P.M., Harrison, D.J., Begum, Z.
Format Journal Article
LanguageEnglish
Published MCB UP Ltd 01.06.2002
Subjects
Conductive layers
Printed circuits
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Summary:This paper concerns a novel process for forming additive copper interconnect on flexible substrates via printing and plating processes. Building on the established conductive lithographic film and CLF plating seeding technologies, the described process enables lowcost substitutes for existing flexible electronic wiring boards to be manufactured without precious metals.
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ISSN:0305-6120
DOI:10.1108/03056120210412490