Highperformance substrate from new epoxy resin and enhanced copper foil

• Published in: Circuit world Vol. 30; no. 4; pp. 20 - 26
• Main Authors: Valette, Ludovic, Wiechmann, Rudolf
• Format: Journal Article
• Language: English
• Published: Emerald Group Publishing Limited 01.12.2004
• Subjects: Adhesion; Epoxy resins; Thermal stability
• ISSN: 0305-6120
• DOI: 10.1108/03056120410539876

The Dow Chemical Company has developed a new epoxybased system to serve the growing need for highperformance dielectric substrates, requiring high thermal reliability high Tg, high thermal resistance and high signal speed and integrity low dielectric constant and low loss factor. The system is based on advanced, proprietary resin technologies. The process latitude of this system is very similar to traditional high Tg FR4 products. The optimized rheology of the system leads to consistent, controlled flow. The copper foil JTCHTEAB from Gould Electronics, where AB stands for advanced bond, is interesting in this context as it was developed for use on highperformance laminates with a typically lower ability for copper bonding, such as high Tg and low DkDf substrates. When the LDkHTd resin is used in combination with the JTCHTEAB copper foil, the copper peel strength fully meets the industry standard for high Tg FR4 laminates.