Assessing circuit level impact of self-heating in 0.13 /spl mu/m SOI CMOS

• Published in: 2001 IEEE International SOI Conference. Proceedings (Cat. No.01CH37207) pp. 101 - 102
• Main Authors: Sinha, S.P., Pelella, M., Tretz, C., Riccobene, C.
• Format: Conference Proceeding
• Language: English
• Published: IEEE 2001
• Subjects: Circuit simulation; CMOS technology; Cogeneration; Conducting materials; Cooling; Fingers; Integrated circuit interconnections; MOSFETs; Temperature sensors; Thermal conductivity

3D simulations have been performed to study the impact of self-heating in SOI on circuits. Using multiple finger structures we have established bounds on the magnitude of the heat increase and its behavior with device scaling. This allows circuit designers to quickly evaluate temperature variations...