Gap filling with high current pulsed are evaporation : influence of deposition parameters

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Bibliographic Details
Published inEuropean Workshop Materials for Advanced Metallization p. 136
Main Authors Klimes, W., Wenzel, C., Siemroth, P., Schultrich, B.
Format Conference Proceeding
LanguageEnglish
Published IEEE 1998
Subjects
Atherosclerosis
Copper
Filling
Inorganic materials
Laboratories
Metallization
Physics
Semiconductor materials
Sputtering
Substrates
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ISSN:1266-0167
DOI:10.1109/MAM.1998.887545