Optoelectronic VLSI switching chip with greater than 4000 optical I/O based on flip chip bonding of GaAs-AlGaAs MQW modulators and detectors to silicon CMOS

Summary form only given. Optical interconnections between electronic devices is expected to alleviate the communication bottleneck that exists in today's electronic switching and computing systems. A particularly attractive approach is to integrate the optical detectors and modulators or source...

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Published inSummaries of papers presented at the Conference on Lasers and Electro-Optics pp. 517 - 518
Main Authors Lentine, A.L., Goossen, K.W., Walker, J.A., Chirovsky, L.M.F., D'Asaro, L.A., Hui, S.P., Tseng, B.T., Leibenguth, R.E., Cunningham, J.E., Jan, W.Y., Kuo, J.M., Dahringer, D., Kossives, D., Bacon, D.D., Livescu, G., Morrison, R.L., Novotny, R.A., Buchholz, D.B.
Format Conference Proceeding
LanguageEnglish
Published IEEE 1996
Subjects
Bonding
Circuits
Communication switching
Flip chip
High speed optical techniques
Optical interconnections
Optical modulation
Quantum well devices
Silicon
Very large scale integration
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Summary:Summary form only given. Optical interconnections between electronic devices is expected to alleviate the communication bottleneck that exists in today's electronic switching and computing systems. A particularly attractive approach is to integrate the optical detectors and modulators or sources directly onto electronic circuitry. We believe we present the first high speed optoelectronic VLSI switching chip using this technology. The circuit has 4096 optical detectors, 256 optical modulators, 140 K FETs. The circuit implements 16 16/spl times/16 fully interconnected switches.
ISBN:1557524432
9781557524430