Optimally selecting packaging technologies and circuit partitions based on cost and performance

Most power electronics circuits are packaged using two or more power electronics packaging technologies. To optimally select and use several technologies that meet performance requirements at minimum cost requires a strategic partitioning of the circuit. Presented is a structured technique for optim...

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Bibliographic Details
Published inAPEC 2000. Fifteenth Annual IEEE Applied Power Electronics Conference and Exposition (Cat. No.00CH37058) Vol. 1; pp. 31 - 38 vol.1
Main Authors Jacobsen, J.B., Hopkins, D.C.
Format Conference Proceeding
LanguageEnglish
Published IEEE 2000
Subjects
Circuits
Cost function
Electronic packaging thermal management
Electronics packaging
Energy management
Jacobian matrices
Power electronics
Power supplies
Surface-mount technology
Technology management
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Summary:Most power electronics circuits are packaged using two or more power electronics packaging technologies. To optimally select and use several technologies that meet performance requirements at minimum cost requires a strategic partitioning of the circuit. Presented is a structured technique for optimally selecting technologies based on a relative cost diagram. Other factors, such as performance, product volume and modularity are included.
ISBN:9780780358645
0780358643
DOI:10.1109/APEC.2000.826079