New TCE-matched glass-ceramic multi-chip module. I. Electrical design and characterization

A glass-ceramic multichip packaging technology for high-I/O-count, large-area silicon chips is discussed. The module substrate material is a new glass-ceramic (Corning 9641), which can be TCE (thermal coefficient of expansion) matched to silicon (3.4 p.p.m./ degrees C). This material possesses a low...

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Bibliographic Details
Published inProceedings., 39th Electronic Components Conference pp. 647 - 651
Main Authors Pence, W.E., Krusius, J.P., Subrahmanyan, R., Li, C.Y., Carrier, G., Francis, G.L., Paisley, R.J., Holleran, L.M.
Format Conference Proceeding
LanguageEnglish
Published IEEE 1989
Subjects
Ceramics
Dielectric materials
Materials testing
Packaging
Silicon
Space technology
Thermal expansion
Thermal stresses
Transmission line measurements
Vehicles
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Summary:A glass-ceramic multichip packaging technology for high-I/O-count, large-area silicon chips is discussed. The module substrate material is a new glass-ceramic (Corning 9641), which can be TCE (thermal coefficient of expansion) matched to silicon (3.4 p.p.m./ degrees C). This material possesses a low dielectric constant
DOI:10.1109/ECC.1989.77819