Packaging system for high performance computer

• Published in: Proceedings. Japan IEMT Symposium, Sixth IEEE/CHMT International Electronic Manufacturing Technology Symposium pp. 83 - 89
• Main Author: Wessely, H.
• Format: Conference Proceeding
• Language: English
• Published: IEEE 1989
• Subjects: Cold plates; Connectors; Cooling; Heat transfer; High performance computing; Large scale integration; Multichip modules; Packaging; Power dissipation; Wiring
• DOI: 10.1109/IEMTS.1989.76115

A novel micropackaging system that meets the requirements of increased packaging and heat density is described. The use of bare LSI gate arrays allows the realization of gate densities of up to 4000 gate functions per 1 cm/sup 2/. New wiring technologies allow these ICs to be wired as a dense configuration. High packaging densities result in high power dissipation. High-efficiency cooling is therefore used, with heat being transferred directly to the cooling medium. The micropackaging system allows the main unit of the mainframe to be designed as a planar system. Up to nine multichip modules (MCMs) can be plugged into a micropackaging board (MPB). A planar module connector with a total of 1850 contact springs is mounted on one side of the MCM, and the other side has an integrated heat sink for transferring the power dissipated to the water-cooled cold plate (CP) of the main unit. This cold plate, which removes the heat generated by an entire unit, is rigidly mounted to the frame of the cabinet. On the module-mounting side of the MPB decoupling capacitors are placed close to the modules. An aluminum frame on the same side assures the uniform distribution of the 0 V potential, mechanically reinforces the main unit, and accommodates modules and tools.< >