A vertical interconnect with DC-block using a low-cost technology at mm-wave frequencies

A vertical interconnect for densely packed active antenna array front-ends between K- and V-band is studied in this paper. The interconnect provides DC-blocking, which is useful for hybrid integration of switched or active components within a vertical module stack. The DC-blocking functionality is i...

Full description

Saved in:
Bibliographic Details
Published in2014 Asia-Pacific Microwave Conference pp. 277 - 279
Main Authors Friesicke, C., Rohrdantz, B., Stark, A., Jacob, A. F.
Format Conference Proceeding
LanguageEnglish
Published IEICE 01.11.2014
Subjects
active antennas
Arrays
Capacitance
Dielectrics
Hybrid integrated circuit interconnections
Integrated circuit interconnections
Permittivity
Satellite communication
Scattering parameters
Online AccessGet full text

Cover

More Information
Summary:A vertical interconnect for densely packed active antenna array front-ends between K- and V-band is studied in this paper. The interconnect provides DC-blocking, which is useful for hybrid integration of switched or active components within a vertical module stack. The DC-blocking functionality is implemented using the solder mask film commonly available in low-cost PCB fabrication processes. The design is robust against lateral misalignment and compatible with a wide range of solder mask dielectrics. The measured performance shows good matching between 20 GHz and 50 GHz, which makes the design attractive for current and emerging satellite communication bands.
ISSN:2165-4727
2165-4743