Design and fabrication of a 315 μΗ bondwire micro-transformer for ultra-low voltage energy harvesting

This paper presents a design study of a new topology for miniaturized bondwire transformers fabricated and assembled with standard IC bonding wires and toroidal ferrite (Fair-Rite 5975000801) as a magnetic core. The microtransformer realized on a PCB substrate, enables the build of magnetics on-top-...

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Bibliographic Details
Published in2014 Design, Automation & Test in Europe Conference & Exhibition (DATE) pp. 1 - 4
Main Authors Macrelli, Enrico, Wang, Ningning, Roy, Saibal, Hayes, Michael, Paganelli, Rudi Paolo, Tartagni, Marco, Romani, Aldo
Format Conference Proceeding
LanguageEnglish
Published EDAA 01.03.2014
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Summary:This paper presents a design study of a new topology for miniaturized bondwire transformers fabricated and assembled with standard IC bonding wires and toroidal ferrite (Fair-Rite 5975000801) as a magnetic core. The microtransformer realized on a PCB substrate, enables the build of magnetics on-top-of-chip, thus leading to the design of high power density components. Impedance measurements in a frequency range between 100 kHz to 5 MHz, show that the secondary self-inductance is enhanced from 0.3 μH with an epoxy core to 315 μH with the ferrite core. Moreover, the micro-machined ferrite improves the coupling coefficient from 0.1 to 0.9 and increases the effective turns ratio from 0.5 to 35. Finally, a low-voltage IC DC-DC converter solution, with the transformer mounted on-top, is proposed for energy harvesting applications.
ISSN:1530-1591
1558-1101
DOI:10.7873/DATE.2014.155