A 1 MHz, 100 W commercial, high-density point-of-load power supply using direct-bond copper and surface mount technologies

A point-of-load power supply is designed for use in a distributed power system. In order to be commercially viable this supply requires low-cost components and packaging, while maintaining a small footprint and a half-inch height for interboard spacing requirements. The unique combination of direct-...

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Bibliographic Details
Published inFifth Annual Proceedings on Applied Power Electronics Conference and Exposition pp. 55 - 63
Main Authors Fisher, R.A., Yerman, A.J., Claydon, G.S., Kuo, M.H.
Format Conference Proceeding
LanguageEnglish
Published IEEE 1990
Subjects
Copper
FETs
Frequency
Inductance
Magnetic resonance
Packaging
Power supplies
Rectifiers
Surface-mount technology
Topology
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Summary:A point-of-load power supply is designed for use in a distributed power system. In order to be commercially viable this supply requires low-cost components and packaging, while maintaining a small footprint and a half-inch height for interboard spacing requirements. The unique combination of direct-bond copper, surface mount, and advanced magnetic technologies permits an estimated maximum hybrid power density of 40 W/in/sup 3/ while using low-cost, readily available commercial components. Packaging details of a 100 W prototype operating at 1 MHz with 34 W/in/sup 3/ hybrid power density are described, including packaging constraints caused by the electrical requirements of the resonant topology utilized. In addition, thermal considerations which must be met in order to reach the maximum hybrid power density are discussed.< >
DOI:10.1109/APEC.1990.66397