Direct measurement of stress-induced void growth by thermal wave modulated optical reflectance image

Thermal wave modulated optical reflectance imaging, for imaging stress-induced voids in metallization, is described. This method nondestructively detects, with submicron resolution, voids within metallization without removal of the stress-originating passivation layers. The width, area, location, an...

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Bibliographic Details
Published in28th Annual Proceedings on Reliability Physics Symposium pp. 200 - 208
Main Authors Smith, L.W., Welles, C., Bivas, A., Yost, F.G., Campbell, J.E.
Format Conference Proceeding
LanguageEnglish
Published IEEE 1990
Subjects
Area measurement
Metallization
Optical imaging
Optical modulation
Passivation
Photothermal effects
Reflectivity
Statistics
Stress measurement
Thermal stresses
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Summary:Thermal wave modulated optical reflectance imaging, for imaging stress-induced voids in metallization, is described. This method nondestructively detects, with submicron resolution, voids within metallization without removal of the stress-originating passivation layers. The width, area, location, and a thickness parameter for each void are measured after heat treatment at 673 K for various times. All voids in a selected field of view are automatically labeled and measured at each time step. This removes the tedium of manually measuring individual voids and greatly increases void growth statistics. These statistics are then compared with a stress-driven diffusive model of void growth. This nondestructive technique has allowed observation of two new stress-void phenomena: a growth process akin to Ostwald ripening and the physical movement and agglomeration of voids.< >
DOI:10.1109/RELPHY.1990.66087