Plastic encapsulated 1.3-/spl mu/m laser on Si substrate for long-haul transmission

Summary form only given. This paper reports 1.3-/spl mu/m laser passively aligned with a cleaved single-mode fiber and encapsulated with silicone rubber on a Si substrate. Under 70-mA DC operation at 85/spl deg/C, a fiber power >2 mW is obtained for several assemblies. This result is thought to b...

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Bibliographic Details
Published inOFC '98. Optical Fiber Communication Conference and Exhibit. Technical Digest. Conference Edition. 1998 OSA Technical Digest Series Vol.2 (IEEE Cat. No.98CH36177) pp. 348 - 349
Main Authors Artigue, C., Rabaron, S., Toullier, D., Lestra, A., Tregoat, D., Lafragette, J.-L., Grard, E., Fernier, B., Jorg, W., Scherb, J., Seibold, G., Goth, A.
Format Conference Proceeding
LanguageEnglish
Published IEEE 1998
Subjects
Assembly
Electron optics
Encapsulation
Fiber lasers
Laser modes
Optical fiber communication
Optical fibers
Plastics
Quantum well lasers
Rubber
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Summary:Summary form only given. This paper reports 1.3-/spl mu/m laser passively aligned with a cleaved single-mode fiber and encapsulated with silicone rubber on a Si substrate. Under 70-mA DC operation at 85/spl deg/C, a fiber power >2 mW is obtained for several assemblies. This result is thought to be the highest value reported so far for such type of device. It shows that these advanced technologies are promising for long-haul transmission.
ISBN:9781557525215
1557525218
DOI:10.1109/OFC.1998.657462