A microassembly structure for intracortical three-dimensional electrode arrays

A practical microassembly process has been developed to create three-dimensional (3D) microelectrode arrays for recording and stimulation in the central nervous system using micromachined 2D probe components. Orthogonal lead transfers between the probes and a cortical surface platform are formed by...

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Bibliographic Details
Published inProceedings of 18th Annual International Conference of the IEEE Engineering in Medicine and Biology Society Vol. 1; pp. 264 - 265 vol.1
Main Authors Qing Bai, Wise, K.D., Hetke, J.F., Anderson, D.J.
Format Conference Proceeding
LanguageEnglish
Published IEEE 1996
Subjects
Animal structures
Assembly
Biological tissues
Bonding
Electrodes
Fabrication
Gold
Microassembly
Microelectrodes
Probes
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Summary:A practical microassembly process has been developed to create three-dimensional (3D) microelectrode arrays for recording and stimulation in the central nervous system using micromachined 2D probe components. Orthogonal lead transfers between the probes and a cortical surface platform are formed by attaching gold beams on the probes to pads on the platform using wire-free ultrasonic bonding. The low-profile (150 /spl mu/m) outrigger design of the probes allows the bonding of fully-assembled high-density arrays. Micromachined microtools allow full array assembly in about 30 minutes. Arrays having up to 8/spl times/16-shanks on 200 /spl mu/m centers have been realized and used to record cortical single units successfully. Dynamic insertion devices have also been explored to allow the implantation of these high-density probe arrays into feline cortex at high speed.
ISBN:9780780338111
0780338111
DOI:10.1109/IEMBS.1996.656945