Low profile DC-DC power converter for 3-D electronics assembly

A 130 W/in/sup 3/ 48Vdc-to-3.3Vdc power converter has been developed for an avionics distributed power system. This converter employs advanced packaging based on the GE-Lockheed Martin High Density Interconnect technology and new ultra low profile magnetics to provide a 150 mil high form factor that...

Full description

Saved in:
Bibliographic Details
Published in16th DASC. AIAA/IEEE Digital Avionics Systems Conference. Reflections to the Future. Proceedings Vol. 1; pp. 2.3 - 21
Main Authors Korman, C.S., Ramakrishnan, S., Steigenvald, R.L., Fisher, R.A., Hennessy, W., Bicknell, W., Wojnarowski, R., Peczalski, A., Baier, S.
Format Conference Proceeding
LanguageEnglish
Published IEEE 1997
Subjects
Aerospace electronics
Assembly
DC-DC power converters
Electronic packaging thermal management
Electronics packaging
Integrated circuit interconnections
Power semiconductor switches
Power system interconnection
Signal processing
Substrates
Online AccessGet full text

Cover

More Information
Summary:A 130 W/in/sup 3/ 48Vdc-to-3.3Vdc power converter has been developed for an avionics distributed power system. This converter employs advanced packaging based on the GE-Lockheed Martin High Density Interconnect technology and new ultra low profile magnetics to provide a 150 mil high form factor that is consistent with high density 3D electronics packaging.
ISBN:9780780341500
0780341503
DOI:10.1109/DASC.1997.635039