Low temperature Au-Au bonding with VUV/O3 treatment

This paper describes low temperature Au-Au bonding with vacuum ultraviolet (VUV) irradiation in the presence of oxygen gas. The VUV/O 3 treatment can remove organic contaminants of Au surfaces without damages. The Au surfaces after the VUV/O 3 treatment were analyzed by X-ray photoelectron spectrosc...

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Published in2011 IEEE International 3D Systems Integration Conference (3DIC), 2011 IEEE International pp. 1 - 5
Main Authors Okada, A., Nimura, M., Unami, N., Shigetou, A., Noma, H., Sakuma, K., Mizuno, J., Shoji, S.
Format Conference Proceeding
LanguageEnglish
Published IEEE 01.01.2012
Subjects
Bonding
Gold
Optical surface waves
Rough surfaces
Surface contamination
Surface roughness
Surface treatment
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Summary:This paper describes low temperature Au-Au bonding with vacuum ultraviolet (VUV) irradiation in the presence of oxygen gas. The VUV/O 3 treatment can remove organic contaminants of Au surfaces without damages. The Au surfaces after the VUV/O 3 treatment were analyzed by X-ray photoelectron spectroscopy (XPS) and atomic force microscopy (AFM). The results show that carbon-based contaminants were dramatically decreased and that there were no serious damages in Au surfaces by the VUV/O 3 treatment. The Au-Au bonding with VUV/O 3 treatment was achieved at 200 °C. The average of shear strength of about 80 MPa per unit area was obtained. Therefore, it was proved that VUV/O 3 treatment is effective in Au-Au bonding.
ISBN:9781467321891
1467321893
DOI:10.1109/3DIC.2012.6263015