SiCp/Cu composites prepared by the dual-directional extrusion process of floating die

SiCp/Cu composites were fabricated by the dual directional extrusion process of the floating die. The microstructure, wear behavior and conductivity of SiCp/Cu composites were studied by optical microscope, abrasion test and current conductivity instrument. The results show that the SiCp/Cu composit...

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Bibliographic Details
Published in2011 Second International Conference on Mechanic Automation and Control Engineering pp. 6068 - 6071
Main Authors Jin Wang, Niansuo Xie, Chunyue Li
Format Conference Proceeding
LanguageEnglish
Published IEEE 01.07.2011
Subjects
Conductivity
Copper
Educational institutions
Materials
Microstructure
Resistance
SiCp/Cu composite materials
Silicon carbide
wear performaaance
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Summary:SiCp/Cu composites were fabricated by the dual directional extrusion process of the floating die. The microstructure, wear behavior and conductivity of SiCp/Cu composites were studied by optical microscope, abrasion test and current conductivity instrument. The results show that the SiCp/Cu composites with SiC particle distributed uniformly can be obtained, and the conductivity of composites decreased with the increasing of concentration of SiC particles, the wear resistance behavior of SiCp/Cu composites is evidently better than Cu with the increasing of concentration of SiC particles, the wearing mechanism of composites is a synthetically combined function of micro-cutting wearing and surface peeling off and grain wearing.
ISBN:9781424494361
1424494362
DOI:10.1109/MACE.2011.5988421