Smart stackingTM technology: An industrial solution for 3D layer stacking

Smart Stacking™ is a wafer-to-wafer stacking technology of partially or fully processed wafers. This technology enables transferring very thin layers in a high volume manufacturing environment. The core technologies are surface conditioning, low temperature direct bonding and wafer thinning (figure...

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Bibliographic Details
Published in2011 IEEE International Conference on IC Design & Technology pp. 1 - 4
Main Authors Blanchard, C L, Radu, I, Sadaka, M, Landry, K
Format Conference Proceeding
LanguageEnglish
Published IEEE 01.05.2011
Subjects
Bonding
Stacking
Surface morphology
Surface topography
Surface treatment
Three dimensional displays
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Summary:Smart Stacking™ is a wafer-to-wafer stacking technology of partially or fully processed wafers. This technology enables transferring very thin layers in a high volume manufacturing environment. The core technologies are surface conditioning, low temperature direct bonding and wafer thinning (figure 1). This technology is adapted for advanced semiconductor applications such as Back Side Illumination (BSI) CMOS Image Sensors (CIS) as well as 3D integration approaches.
ISBN:1424490197
9781424490196
ISSN:2381-3555
2691-0462
DOI:10.1109/ICICDT.2011.5783202