Modeling of simultaneous switching ground noise for BiCMOS drivers
A model of simultaneous switching ground noise for the BiCMOS driver is presented. Level I SPICE-type MOSFET and Gummel-Poon BJT device models are used for the analysis. Immunity of the quiet BiCMOS driver to noise present at the ground and power connections is also investigated.
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Published in | Proceedings of Electrical Performance of Electronic Packaging pp. 33 - 36 |
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Main Authors | , |
Format | Conference Proceeding |
Language | English |
Published |
IEEE
1995
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Subjects | |
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Abstract | A model of simultaneous switching ground noise for the BiCMOS driver is presented. Level I SPICE-type MOSFET and Gummel-Poon BJT device models are used for the analysis. Immunity of the quiet BiCMOS driver to noise present at the ground and power connections is also investigated. |
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AbstractList | A model of simultaneous switching ground noise for the BiCMOS driver is presented. Level I SPICE-type MOSFET and Gummel-Poon BJT device models are used for the analysis. Immunity of the quiet BiCMOS driver to noise present at the ground and power connections is also investigated. |
Author | Prince, J.L. Seeker, D.A. |
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Snippet | A model of simultaneous switching ground noise for the BiCMOS driver is presented. Level I SPICE-type MOSFET and Gummel-Poon BJT device models are used for the... |
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StartPage | 33 |
SubjectTerms | BiCMOS integrated circuits Circuit noise Driver circuits Electronics packaging Integrated circuit noise MOSFET circuits Production Semiconductor device noise Switches Threshold voltage |
Title | Modeling of simultaneous switching ground noise for BiCMOS drivers |
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