Speed, power, and yield comparison of thin bonded SOI versus bulk CMOS technologies

• Published in: Proceedings. IEEE International SOI Conference pp. 41 - 42
• Main Authors: Nowak, E.D., Ding, L., Loh, Y.T., Hu, C.
• Format: Conference Proceeding
• Language: English
• Published: IEEE 1994
• Subjects: CMOS technology; Delay effects; MOSFET circuits; Power supplies; Semiconductor films; Silicon on insulator technology; Testing; Vehicles; Voltage; Wafer bonding

As it becomes more difficult to increase MOSFET current drive through standard scaling techniques, other methods to improve performance are being pursued. One such technique is to use silicon-on-insulator (SOI) starting wafers. Performance enhancements using SOI have been demonstrated by a number of...