Application of capacitive coupling to switch fabrics

In this paper, we look beyond conductive coupling to the fundamental opportunity for passing signals between chips by non-conductive means. Capacitively coupled interconnects afford a number of advantages over conventional, conductive junctions in flipped chip MCM designs. The main focus of this pap...

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Published inProceedings of 1995 IEEE Multi-Chip Module Conference (MCMC-95) pp. 195 - 199
Main Authors Salzman, D., Knight, T., Franzon, P.
Format Conference Proceeding
LanguageEnglish
Published IEEE 1995
Subjects
Capacitors
Circuit testing
Fabrics
Pulse amplifiers
Pulse inverters
Semiconductor device noise
Signal restoration
Substrates
Switches
Voltage
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Abstract In this paper, we look beyond conductive coupling to the fundamental opportunity for passing signals between chips by non-conductive means. Capacitively coupled interconnects afford a number of advantages over conventional, conductive junctions in flipped chip MCM designs. The main focus of this paper is to describe a conceptual design for a switch fabric that employs the unique advantages of capacitively coupled multichip modules. A secondary focus is to describe current experiments-in-progress intended to demonstrate the utility and advantages of capacitive coupling.
AbstractList In this paper, we look beyond conductive coupling to the fundamental opportunity for passing signals between chips by non-conductive means. Capacitively coupled interconnects afford a number of advantages over conventional, conductive junctions in flipped chip MCM designs. The main focus of this paper is to describe a conceptual design for a switch fabric that employs the unique advantages of capacitively coupled multichip modules. A secondary focus is to describe current experiments-in-progress intended to demonstrate the utility and advantages of capacitive coupling.
Author Knight, T.
Franzon, P.
Salzman, D.
Author_xml – sequence: 1
  givenname: D.
  surname: Salzman
  fullname: Salzman, D.
  organization: Polychip Inc., Washington, DC, USA
– sequence: 2
  givenname: T.
  surname: Knight
  fullname: Knight, T.
  organization: Polychip Inc., Washington, DC, USA
– sequence: 3
  givenname: P.
  surname: Franzon
  fullname: Franzon, P.
  organization: Polychip Inc., Washington, DC, USA
BookMark eNp9jr0KwjAYAD9Qwb_u4pQXsCa1SZNRiuLSzb3EkOonNQlNVXx7BZ295YZbbgpD550FWDCaMkbVuiqrMmVK8ZSzjGZiAIkqJJVMCqEKyseQxHilHziXPBcTyLchtGh0j94R3xCjgzbY48MS4--f5M6k9yQ-sTcX0uhThybOYdToNtrk5xks97tjeVihtbYOHd5096q_C5u_8Q0n3jZO
ContentType Conference Proceeding
DBID 6IE
6IL
CBEJK
RIE
RIL
DOI 10.1109/MCMC.1995.512026
DatabaseName IEEE Electronic Library (IEL) Conference Proceedings
IEEE Proceedings Order Plan All Online (POP All Online) 1998-present by volume
IEEE Xplore All Conference Proceedings
IEEE Xplore
IEEE Proceedings Order Plans (POP All) 1998-Present
DatabaseTitleList
Database_xml – sequence: 1
  dbid: RIE
  name: IEEE
  url: https://proxy.k.utb.cz/login?url=https://ieeexplore.ieee.org/
  sourceTypes: Publisher
DeliveryMethod fulltext_linktorsrc
EndPage 199
ExternalDocumentID 512026
GroupedDBID 6IE
6IK
6IL
AAJGR
ACGHX
ALMA_UNASSIGNED_HOLDINGS
BEFXN
BFFAM
BGNUA
BKEBE
BPEOZ
CBEJK
OCL
RIB
RIC
RIE
RIL
ID FETCH-ieee_primary_5120263
IEDL.DBID RIE
ISBN 9780818669705
0818669705
IngestDate Wed Jun 26 19:25:10 EDT 2024
IsPeerReviewed false
IsScholarly false
Language English
LinkModel DirectLink
MergedId FETCHMERGED-ieee_primary_5120263
ParticipantIDs ieee_primary_512026
PublicationCentury 1900
PublicationDate 19950000
PublicationDateYYYYMMDD 1995-01-01
PublicationDate_xml – year: 1995
  text: 19950000
PublicationDecade 1990
PublicationTitle Proceedings of 1995 IEEE Multi-Chip Module Conference (MCMC-95)
PublicationTitleAbbrev MCMC
PublicationYear 1995
Publisher IEEE
Publisher_xml – name: IEEE
SSID ssj0000558546
Score 2.5025685
Snippet In this paper, we look beyond conductive coupling to the fundamental opportunity for passing signals between chips by non-conductive means. Capacitively...
SourceID ieee
SourceType Publisher
StartPage 195
SubjectTerms Capacitors
Circuit testing
Fabrics
Pulse amplifiers
Pulse inverters
Semiconductor device noise
Signal restoration
Substrates
Switches
Voltage
Title Application of capacitive coupling to switch fabrics
URI https://ieeexplore.ieee.org/document/512026
hasFullText 1
inHoldings 1
isFullTextHit
isPrint
link http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwjV1JS8QwGP1w5uTJbUTHhRy8tlPJZo5SHAah4kFhbkOzVERoxbYI_nq_JGMHZQ7ekhySkJC8fMt7AbgSylDHK5kIXcqEWTzpZZXZJHMG70Nub0SImBYPYvHM7pd8udbZDlwY51xIPnOpL4ZYvm1M711lMwQnNBlGMJJKRarW4E7JOL57mQgKj17DTcmMr_V1hvpPlDJTsyIvck_U42ns89ffKgFa5nuRs90GRUKfUfKW9p1OzdcfvcZ_znofJhsOH3kc0OkAdlx9BOx2E68mTUUMQqUJ2UPENL0n576QriHt5ytuJqlKjbdkO4Hp_O4pXyR-0NV7lKdYxfHoMYzrpnYnQLjTaLZIygTVzGhcEColmjLClt6euD6Fwy0dTLe2nsFuJHV7J8Q5jLuP3l0gLHf6MmzIN9xqjJM
link.rule.ids 310,311,783,787,792,793,799,4059,4060,27939,55088
linkProvider IEEE
linkToHtml http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwjV1NS8MwGH7RedCTXxOdXzl4bVdpPuxRiqPqOjxM2K00aSoitGJbBH-9b5LZoezgLckhCQnJk_fjeQJwxSMValYKj8tceLTAk56XQeEFWuF9yIobbiOm6Ywnz_RhwRZLnW3LhdFa2-Qz7ZuijeUXteqMq2yM4IQmwyZsMfOscGSt3qESMHz5Um41Ho2KWyQCtlTY6es_ccogGqdxGhuqHvNdr79-V7HgMtl1rO3GahKanJI3v2ulr77-KDb-c957MFyx-MhTj0_7sKGrQ6C3q4g1qUuiECyVzR8iqu4MPfeFtDVpPl9xO0mZS7wnmyGMJnfzOPHMoNm7E6jI3HjhEQyqutLHQJiWaLiIkPJQUiVxQUIh0JjhRW4siusTOFjTwWht6yVsJ_N0mk3vZ4-nsOMo3sYlcQaD9qPT5wjSrbywm_MNb3SP4A
openUrl ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Abook&rft.genre=proceeding&rft.title=Proceedings+of+1995+IEEE+Multi-Chip+Module+Conference+%28MCMC-95%29&rft.atitle=Application+of+capacitive+coupling+to+switch+fabrics&rft.au=Salzman%2C+D.&rft.au=Knight%2C+T.&rft.au=Franzon%2C+P.&rft.date=1995-01-01&rft.pub=IEEE&rft.isbn=9780818669705&rft.spage=195&rft.epage=199&rft_id=info:doi/10.1109%2FMCMC.1995.512026&rft.externalDocID=512026
thumbnail_l http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=9780818669705/lc.gif&client=summon&freeimage=true
thumbnail_m http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=9780818669705/mc.gif&client=summon&freeimage=true
thumbnail_s http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=9780818669705/sc.gif&client=summon&freeimage=true