Application of capacitive coupling to switch fabrics

In this paper, we look beyond conductive coupling to the fundamental opportunity for passing signals between chips by non-conductive means. Capacitively coupled interconnects afford a number of advantages over conventional, conductive junctions in flipped chip MCM designs. The main focus of this pap...

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Bibliographic Details
Published inProceedings of 1995 IEEE Multi-Chip Module Conference (MCMC-95) pp. 195 - 199
Main Authors Salzman, D., Knight, T., Franzon, P.
Format Conference Proceeding
LanguageEnglish
Published IEEE 1995
Subjects
Capacitors
Circuit testing
Fabrics
Pulse amplifiers
Pulse inverters
Semiconductor device noise
Signal restoration
Substrates
Switches
Voltage
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Summary:In this paper, we look beyond conductive coupling to the fundamental opportunity for passing signals between chips by non-conductive means. Capacitively coupled interconnects afford a number of advantages over conventional, conductive junctions in flipped chip MCM designs. The main focus of this paper is to describe a conceptual design for a switch fabric that employs the unique advantages of capacitively coupled multichip modules. A secondary focus is to describe current experiments-in-progress intended to demonstrate the utility and advantages of capacitive coupling.
ISBN:9780818669705
0818669705
DOI:10.1109/MCMC.1995.512026