Particulate contamination control in plasma processing: building-in reliability for semiconductor fabrication
Plasma processing is used for /spl sim/35% of the process steps required for semiconductor manufacturing. Recent studies have shown that plasma processes create the greatest amount of contaminant dust of all the manufacturing steps required for device fabrication. Often, the level of dust in a plasm...
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Published in | IEEE 1995 International Integrated Reliability Workshop. Final Report pp. 122 - 129 |
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Main Author | |
Format | Conference Proceeding |
Language | English |
Published |
IEEE
1995
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Subjects | |
Online Access | Get full text |
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