Particulate contamination control in plasma processing: building-in reliability for semiconductor fabrication

Plasma processing is used for /spl sim/35% of the process steps required for semiconductor manufacturing. Recent studies have shown that plasma processes create the greatest amount of contaminant dust of all the manufacturing steps required for device fabrication. Often, the level of dust in a plasm...

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Bibliographic Details
Published inIEEE 1995 International Integrated Reliability Workshop. Final Report pp. 122 - 129
Main Author Selwyn, G.S.
Format Conference Proceeding
LanguageEnglish
Published IEEE 1995
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