Particulate contamination control in plasma processing: building-in reliability for semiconductor fabrication

• Published in: IEEE 1995 International Integrated Reliability Workshop. Final Report pp. 122 - 129
• Main Author: Selwyn, G.S.
• Format: Conference Proceeding
• Language: English
• Published: IEEE 1995
• Subjects: Contamination; Dusty plasma; Fabrication; Manufacturing processes; Plasma chemistry; Plasma devices; Plasma materials processing; Plasma transport processes; Process control; Semiconductor device manufacture
• ISBN: 0780327055; 9780780327054
• DOI: 10.1109/IRWS.1995.493585

Plasma processing is used for /spl sim/35% of the process steps required for semiconductor manufacturing. Recent studies have shown that plasma processes create the greatest amount of contaminant dust of all the manufacturing steps required for device fabrication. Often, the level of dust in a plasma process tool exceeds the cleanroom by several orders of magnitude. Particulate contamination generated in a plasma tool can result in reliability problems as well as device failure. Inter-level wiring shorts different levels of metallization on a device is a common result of plasma particulate contamination. We have conducted a thorough study of the physics and chemistry involved in particulate formation and transport in plasma tools. In-situ laser light scattering (LLS) is used for real-time detection of the contaminant dust. The results of this work are highly surprising: all plasmas create dust; the dust can be formed by homogeneous as well as heterogeneous chemistry; this dust is charged and suspended in the plasma; additionally, it is transported to favored regions of the plasma, such as those regions immediately above wafers. Fortunately, this work has also led to a novel means of controlling and eliminating these unwanted contaminants: electrostatic "drainpipes" engineered into the electrode by means of specially designed grooves. These channel the suspended particles out of the plasma and into the pump port before they can fall onto the wafer.