Carrier transport in Si/SiO/sub x//Si structures by direct wafer bonding
The results of carrier transport analysis in silicon tunnel n/sup ++//spl bsol/p/sup ++/ structures made by direct wafer bonding are presented. The idea was to create tunnel transparent SiO/sub x/ layer in which electronic states could be localized at the bonding interface and double barrier tunnel...
Saved in:
Published in | Proceedings. 6th Annual. 2005 International Siberian Workshop and Tutorials on Electron Devices and Materials, 2005 pp. 37 - 38 |
---|---|
Main Authors | , , , |
Format | Conference Proceeding |
Language | English |
Published |
IEEE
2005
|
Subjects | |
Online Access | Get full text |
Cover
Loading…
Be the first to leave a comment!