Carrier transport in Si/SiO/sub x//Si structures by direct wafer bonding

The results of carrier transport analysis in silicon tunnel n/sup ++//spl bsol/p/sup ++/ structures made by direct wafer bonding are presented. The idea was to create tunnel transparent SiO/sub x/ layer in which electronic states could be localized at the bonding interface and double barrier tunnel...

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Bibliographic Details
Published inProceedings. 6th Annual. 2005 International Siberian Workshop and Tutorials on Electron Devices and Materials, 2005 pp. 37 - 38
Main Authors Kurkin, S.G., Plotnikov, Y.V., Efremov, M.D., Kamaev, G.N.
Format Conference Proceeding
LanguageEnglish
Published IEEE 2005
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