Packaging of highly integrated PLC components

We discuss the progress of packaging techniques for highly integrated planar lightwave circuit (PLC) devices. Examples of thermal effects and the integration of power monitors demonstrate interactions between building blocks and the environment.

Saved in:
Bibliographic Details
Published inOptical Fiber Communication Conference, 2004. OFC 2004 Vol. 2; p. 4 pp. vol.2
Main Authors Krabe, D., Heise, G., Zavrsnik, M., Dieckroeger, J., Gao, Z., Schinke, C., Scheubeck, M., Kraeker, T., Krombholz, B., Baumann, I.
Format Conference Proceeding
LanguageEnglish
Published IEEE 2004
Subjects
Circuits
Electronic packaging thermal management
Integrated optics
Optical attenuators
Optical devices
Optical filters
Optical network units
Programmable control
Stimulated emission
Thermal management
Online AccessGet full text

Cover

More Information
Summary:We discuss the progress of packaging techniques for highly integrated planar lightwave circuit (PLC) devices. Examples of thermal effects and the integration of power monitors demonstrate interactions between building blocks and the environment.
ISBN:9781557527721
1557527725