Analysis and characterization of device variations in an LSI chip using an integrated device matrix array

For future LSI design technology, the device matrix array (DMA), which can precisely evaluate variation in device parameters within a die, has been developed. The DMA consists of a 14-by-14 array of common units. The unit size is 240 by 240 /spl mu/m, and each unit contains 148 measurement elements...

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Bibliographic Details
Published inInternational Conference on Microelectronic Test Structures, 2003 pp. 3 - 75
Main Authors Ohkawa, S., Aoki, M., Masuda, H.
Format Conference Proceeding
LanguageEnglish
Published IEEE 2003
Subjects
Electrical resistance measurement
Integrated circuit interconnections
Large scale integration
MOSFETs
Resistors
Semiconductor device measurement
Spatial resolution
Testing
Thermal resistance
Voltage
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Summary:For future LSI design technology, the device matrix array (DMA), which can precisely evaluate variation in device parameters within a die, has been developed. The DMA consists of a 14-by-14 array of common units. The unit size is 240 by 240 /spl mu/m, and each unit contains 148 measurement elements (52 transistors, 30 capacitors, 51 resistors, and 15 ring oscillators).
ISBN:9780780376533
0780376536
DOI:10.1109/ICMTS.2003.1197386