Reliability Evaluation and Case Analysis of Leadless Ceramic Chip Carrier Devices

Owing to the significant difference in the coefficient of thermal expansion between ceramic substrates and FR-4 printed circuit boards (PCBs), a risk of stress-induced cracking and solder joint failure emerges when leadless ceramic chip carrier (LCCC) devices are soldered onto PCBs. Enhancing the re...

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Bibliographic Details
Published in2023 14th International Conference on Reliability, Maintainability and Safety (ICRMS) pp. 717 - 720
Main Authors Tian, Wanchun, Cui, Meilun, Du, Liu, Zhong, Bin, Wu, Mouzhi, Ai, Jing
Format Conference Proceeding
LanguageEnglish
Published IEEE 26.08.2023
Subjects
Adaptation models
Analytical models
Ceramics
cracking
LCCC devices
Lead
Printed circuits
Reliability
Safety
solder joint
Soldering
Stress
Temperature
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Summary:Owing to the significant difference in the coefficient of thermal expansion between ceramic substrates and FR-4 printed circuit boards (PCBs), a risk of stress-induced cracking and solder joint failure emerges when leadless ceramic chip carrier (LCCC) devices are soldered onto PCBs. Enhancing the reliability of LCCC device solder joints is thus a pressing concern. This study addresses this issue by proposing modifications to the soldering process for LCCC devices, involving the augmentation of solder joint height and the introduction of two distinct adapter boards. LCCC devices are affixed to these adapter boards before being integrated into the FR-4 PCB. Reliability assessments of the improved configurations are conducted, taking into account mechanical and temperature stress in accordance with the product's operational environment. The solder joint lifespan, determined through a temperature model, is utilized for comparative analysis, ultimately selecting a soldering process that meets operational requirements, thereby ensuring electronic product reliability.
ISSN:2575-2642
DOI:10.1109/ICRMS59672.2023.00130